@inproceedings{9e1513e37b29400fb374a8072a9b264b,
title = "Parameter sensitivity study of cure-dependent underfill properties on flip chip failures",
keywords = "Conf.proc. > 3 pag",
author = "D Yang and GQ Zhang and {van Driel}, W and J Janssen and HJL Bressers and LJ Ernst",
year = "2002",
language = "Undefined/Unknown",
isbn = "0-7803-7430-4",
publisher = "IEEE Society",
pages = "865--872",
booktitle = "52nd electronic components & technology conference 2002",
note = "Congress, San Diego ; Conference date: 29-05-2002",
}