Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

DG Yang, JS Liang, QY Li, LJ Ernst, GQ Zhang

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	1947-1955
Number of pages	9
Journal	Microelectronics Reliability
Volume	44
Publication status	Published - 2004

Keywords

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title = "Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach",

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author = "DG Yang and JS Liang and QY Li and LJ Ernst and GQ Zhang",

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TY - JOUR

T1 - Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach

AU - Yang, DG

AU - Liang, JS

AU - Li, QY

AU - Ernst, LJ

AU - Zhang, GQ

PY - 2004

Y1 - 2004

KW - ZX CWTS JFIS < 1.00

M3 - Article

SN - 0026-2714

VL - 44

SP - 1947

EP - 1955

JO - Microelectronics Reliability

JF - Microelectronics Reliability

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