Passive or active cooling: a model for fast thermal exploration of electronic product concepts

R. Strijk; J.A.G. de Deugd; JSM Vergeest

Passive or active cooling: a model for fast thermal exploration of electronic product concepts

R. Strijk, J.A.G. de Deugd, JSM Vergeest

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems
Editors	SV Garimella, AS Fleischer
Place of Publication	Rotterdam
Publisher	Millpress
Pages	415-422
Number of pages	8
ISBN (Print)	978-90-5966-051-9
Publication status	Published - 2007
Event	Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems, Santa Fe, USA - Rotterdam Duration: 7 Jan 2007 → 10 Jan 2007

Publication series

Name
Publisher	Millpress

Conference

Conference	Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems, Santa Fe, USA
Period	7/01/07 → 10/01/07

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{103ba71015cb4400976f474d8b8a8b1d,

title = "Passive or active cooling: a model for fast thermal exploration of electronic product concepts",

keywords = "Conf.proc. > 3 pag",

author = "R. Strijk and {de Deugd}, J.A.G. and JSM Vergeest",

year = "2007",

language = "Undefined/Unknown",

isbn = "978-90-5966-051-9",

publisher = "Millpress",

pages = "415--422",

editor = "SV Garimella and AS Fleischer",

booktitle = "Proceedings of Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems",

note = "Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems, Santa Fe, USA ; Conference date: 07-01-2007 Through 10-01-2007",

}

Strijk, R, de Deugd, JAG & Vergeest, JSM 2007, Passive or active cooling: a model for fast thermal exploration of electronic product concepts. in SV Garimella & AS Fleischer (eds), Proceedings of Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems. Millpress, Rotterdam, pp. 415-422, Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems, Santa Fe, USA, 7/01/07.

Passive or active cooling: a model for fast thermal exploration of electronic product concepts. / Strijk, R.; de Deugd, J.A.G.; Vergeest, JSM.
Proceedings of Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems. ed. / SV Garimella; AS Fleischer. Rotterdam: Millpress, 2007. p. 415-422.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Passive or active cooling: a model for fast thermal exploration of electronic product concepts

AU - Strijk, R.

AU - de Deugd, J.A.G.

AU - Vergeest, JSM

PY - 2007

Y1 - 2007

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-90-5966-051-9

SP - 415

EP - 422

BT - Proceedings of Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems

A2 - Garimella, SV

A2 - Fleischer, AS

PB - Millpress

CY - Rotterdam

T2 - Thermes 2007 Conference - Thermal Challenges in Next Generation Electronic Systems, Santa Fe, USA

Y2 - 7 January 2007 through 10 January 2007

ER -