Photonic hybrid assembly through flexible waveguides

Kerstin Wörhoff; Albert Prak; F. Postma; A Leinse; Kai Wu; T. J. Peters; M. Tichem; B. Amaning-Appiah; V. Renukappa; G. Vollrath; J. Balcells-Ventura; P. Uhlig; M. Seyfried; D. Rose; Raquel Santos; X. J.M. Leijtens; B. Flintham; M. Wale; D. Robbins

doi:10.1117/12.2227814

Photonic hybrid assembly through flexible waveguides

Kerstin Wörhoff, Albert Prak, F. Postma, A Leinse, Kai Wu, T. J. Peters, M. Tichem, B. Amaning-Appiah, V. Renukappa, G. Vollrath, J. Balcells-Ventura, P. Uhlig, M. Seyfried, D. Rose, Raquel Santos, X. J.M. Leijtens, B. Flintham, M. Wale, D. Robbins

Micro and Nano Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

152 Downloads (Pure)

Abstract

Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.

Original language	English
Title of host publication	Proceedings Silicon Photonics and Photonic Integrated Circuits V
Editors	Laurent Vivien, Lorenzo Pavesi, Stefano Pelli
Place of Publication	Bellingham, WA, USA
Publisher	SPIE
Number of pages	8
Volume	9891
ISBN (Electronic)	978-1-510601369
DOIs	https://doi.org/10.1117/12.2227814
Publication status	Published - 2016
Event	Silicon Photonics and Photonic Integrated Circuits V - Brussels, Belgium Duration: 3 Apr 2016 → 7 Apr 2016

Publication series

Name	Proceedings of SPIE
Volume	9891
ISSN (Electronic)	1605-7422

Conference

Conference	Silicon Photonics and Photonic Integrated Circuits V
Country/Territory	Belgium
City	Brussels
Period	3/04/16 → 7/04/16

Keywords

Eutectic bonding
Flip-chip
InP
LTCC
MEMS
Photonic assembly
Photonic integrated circuit
TriPleX

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10.1117/12.2227814

98911PFinal published version, 815 KB

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Wörhoff, K., Prak, A., Postma, F., Leinse, A., Wu, K., Peters, T. J., Tichem, M., Amaning-Appiah, B., Renukappa, V., Vollrath, G., Balcells-Ventura, J., Uhlig, P., Seyfried, M., Rose, D., Santos, R., Leijtens, X. J. M., Flintham, B., Wale, M., & Robbins, D. (2016). Photonic hybrid assembly through flexible waveguides. In L. Vivien, L. Pavesi, & S. Pelli (Eds.), Proceedings Silicon Photonics and Photonic Integrated Circuits V (Vol. 9891). Article 98911P (Proceedings of SPIE; Vol. 9891). SPIE. https://doi.org/10.1117/12.2227814

@inproceedings{255eb9bef30c48a38ba236c23c19d83f,

title = "Photonic hybrid assembly through flexible waveguides",

abstract = "Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.",

keywords = "Eutectic bonding, Flip-chip, InP, LTCC, MEMS, Photonic assembly, Photonic integrated circuit, TriPleX",

author = "Kerstin W{\"o}rhoff and Albert Prak and F. Postma and A Leinse and Kai Wu and Peters, {T. J.} and M. Tichem and B. Amaning-Appiah and V. Renukappa and G. Vollrath and J. Balcells-Ventura and P. Uhlig and M. Seyfried and D. Rose and Raquel Santos and Leijtens, {X. J.M.} and B. Flintham and M. Wale and D. Robbins",

year = "2016",

doi = "10.1117/12.2227814",

language = "English",

volume = "9891",

series = "Proceedings of SPIE",

publisher = "SPIE",

editor = "Laurent Vivien and Lorenzo Pavesi and Stefano Pelli",

booktitle = "Proceedings Silicon Photonics and Photonic Integrated Circuits V",

address = "United States",

note = "Silicon Photonics and Photonic Integrated Circuits V ; Conference date: 03-04-2016 Through 07-04-2016",

}

Wörhoff, K, Prak, A, Postma, F, Leinse, A, Wu, K, Peters, TJ, Tichem, M, Amaning-Appiah, B, Renukappa, V, Vollrath, G, Balcells-Ventura, J, Uhlig, P, Seyfried, M, Rose, D, Santos, R, Leijtens, XJM, Flintham, B, Wale, M & Robbins, D 2016, Photonic hybrid assembly through flexible waveguides. in L Vivien, L Pavesi & S Pelli (eds), Proceedings Silicon Photonics and Photonic Integrated Circuits V. vol. 9891, 98911P, Proceedings of SPIE, vol. 9891, SPIE, Bellingham, WA, USA, Silicon Photonics and Photonic Integrated Circuits V, Brussels, Belgium, 3/04/16. https://doi.org/10.1117/12.2227814

Photonic hybrid assembly through flexible waveguides. / Wörhoff, Kerstin; Prak, Albert; Postma, F. et al.
Proceedings Silicon Photonics and Photonic Integrated Circuits V. ed. / Laurent Vivien; Lorenzo Pavesi; Stefano Pelli. Vol. 9891 Bellingham, WA, USA: SPIE, 2016. 98911P (Proceedings of SPIE; Vol. 9891).

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

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T1 - Photonic hybrid assembly through flexible waveguides

AU - Wörhoff, Kerstin

AU - Prak, Albert

AU - Postma, F.

AU - Leinse, A

AU - Wu, Kai

AU - Peters, T. J.

AU - Tichem, M.

AU - Amaning-Appiah, B.

AU - Renukappa, V.

AU - Vollrath, G.

AU - Balcells-Ventura, J.

AU - Uhlig, P.

AU - Seyfried, M.

AU - Rose, D.

AU - Santos, Raquel

AU - Leijtens, X. J.M.

AU - Flintham, B.

AU - Wale, M.

AU - Robbins, D.

PY - 2016

Y1 - 2016

N2 - Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.

AB - Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative - PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.

KW - Eutectic bonding

KW - Flip-chip

KW - InP

KW - LTCC

KW - MEMS

KW - Photonic assembly

KW - Photonic integrated circuit

KW - TriPleX

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U2 - 10.1117/12.2227814

DO - 10.1117/12.2227814

M3 - Conference contribution

AN - SCOPUS:84982281669

VL - 9891

T3 - Proceedings of SPIE

BT - Proceedings Silicon Photonics and Photonic Integrated Circuits V

A2 - Vivien, Laurent

A2 - Pavesi, Lorenzo

A2 - Pelli, Stefano

PB - SPIE

CY - Bellingham, WA, USA

T2 - Silicon Photonics and Photonic Integrated Circuits V

Y2 - 3 April 2016 through 7 April 2016

ER -

Photonic hybrid assembly through flexible waveguides

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Keywords

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