Prediction and verification of process induced warpage of electronic packages

WD van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	765-774
Number of pages	10
Journal	Microelectronics Reliability
Volume	43
Publication status	Published - 2003

Keywords

@article{6f59edb4fdee4f8585a2606023ee844e,

title = "Prediction and verification of process induced warpage of electronic packages",

keywords = "ZX CWTS JFIS < 1.00",

author = "{van Driel}, WD and GQ Zhang and JHJ Janssen and LJ Ernst and F Su and KS Chian and S Yi",

year = "2003",

language = "Undefined/Unknown",

volume = "43",

pages = "765--774",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

}

TY - JOUR

T1 - Prediction and verification of process induced warpage of electronic packages

AU - van Driel, WD

AU - Zhang, GQ

AU - Janssen, JHJ

AU - Ernst, LJ

AU - Su, F

AU - Chian, KS

AU - Yi, S

PY - 2003

Y1 - 2003

KW - ZX CWTS JFIS < 1.00

M3 - Article

SN - 0026-2714

VL - 43

SP - 765

EP - 774

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -