Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

WD van Driel; GQ Zhang; J Janssen; LJ Ernst; F Su; S Yi

Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

WD van Driel, GQ Zhang, J Janssen, LJ Ernst, F Su, S Yi

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics
Editors	LJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronic Engineers (IEEE)
Pages	362-368
Number of pages	7
ISBN (Print)	0-7803-9819-X
Publication status	Published - 2002
Event	EuroSimE 2002 - Paris, France Duration: 15 Apr 2002 → 17 Apr 2002

Conference

Conference	EuroSimE 2002
Country/Territory	France
City	Paris
Period	15/04/02 → 17/04/02

Keywords

Conf.proc. > 3 pag

Cite this

van Driel, WD., Zhang, GQ., Janssen, J., Ernst, LJ., Su, F., & Yi, S. (2002). Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry. In LJ. Ernst, GQ. Zhang, R. Dudek, & O. de Saint Leger (Eds.), 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics (pp. 362-368). Institute of Electrical and Electronic Engineers (IEEE).

van Driel, WD ; Zhang, GQ ; Janssen, J et al. / Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry. 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. editor / LJ Ernst ; GQ Zhang ; R Dudek ; O de Saint Leger. Piscataway : Institute of Electrical and Electronic Engineers (IEEE), 2002. pp. 362-368

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title = "Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry",

keywords = "Conf.proc. > 3 pag",

author = "{van Driel}, WD and GQ Zhang and J Janssen and LJ Ernst and F Su and S Yi",

year = "2002",

language = "Undefined/Unknown",

isbn = "0-7803-9819-X",

pages = "362--368",

editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",

booktitle = "3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics",

publisher = "Institute of Electrical and Electronic Engineers (IEEE)",

note = "EuroSimE 2002 ; Conference date: 15-04-2002 Through 17-04-2002",

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van Driel, WD, Zhang, GQ, Janssen, J, Ernst, LJ, Su, F & Yi, S 2002, Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry. in LJ Ernst, GQ Zhang, R Dudek & O de Saint Leger (eds), 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Institute of Electrical and Electronic Engineers (IEEE), Piscataway, pp. 362-368, EuroSimE 2002, Paris, France, 15/04/02.

Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry. / van Driel, WD; Zhang, GQ; Janssen, J et al.
3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. ed. / LJ Ernst; GQ Zhang; R Dudek; O de Saint Leger. Piscataway: Institute of Electrical and Electronic Engineers (IEEE), 2002. p. 362-368.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

AU - van Driel, WD

AU - Zhang, GQ

AU - Janssen, J

AU - Ernst, LJ

AU - Su, F

AU - Yi, S

PY - 2002

Y1 - 2002

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9819-X

SP - 362

EP - 368

BT - 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Dudek, R

A2 - de Saint Leger, O

PB - Institute of Electrical and Electronic Engineers (IEEE)

CY - Piscataway

T2 - EuroSimE 2002

Y2 - 15 April 2002 through 17 April 2002

ER -

van Driel WD, Zhang GQ, Janssen J, Ernst LJ, Su F, Yi S. Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry. In Ernst LJ, Zhang GQ, Dudek R, de Saint Leger O, editors, 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Piscataway: Institute of Electrical and Electronic Engineers (IEEE). 2002. p. 362-368