Prediction of delamination related ic & packaging reliability problems

WD van Driel, MAJ van Gils, RBR van Silfhout, GQ Zhang

Research output: Contribution to journal › Article › Scientific › peer-review

34 Citations (Scopus)

Original language	Undefined/Unknown
Pages (from-to)	1633-1638
Number of pages	6
Journal	Microelectronics Reliability
Volume	45
Issue number	9-11
DOIs	https://doi.org/doi:10.1016/j.microrel.2005.07.065
Publication status	Published - 2005

Keywords

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title = "Prediction of delamination related ic & packaging reliability problems",

keywords = "ZX CWTS JFIS < 1.00",

author = "{van Driel}, WD and {van Gils}, MAJ and {van Silfhout}, RBR and GQ Zhang",

year = "2005",

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language = "Undefined/Unknown",

volume = "45",

pages = "1633--1638",

journal = "Microelectronics Reliability",

issn = "0026-2714",

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}

TY - JOUR

T1 - Prediction of delamination related ic & packaging reliability problems

AU - van Driel, WD

AU - van Gils, MAJ

AU - van Silfhout, RBR

AU - Zhang, GQ

PY - 2005

Y1 - 2005

KW - ZX CWTS JFIS < 1.00

U2 - doi:10.1016/j.microrel.2005.07.065

DO - doi:10.1016/j.microrel.2005.07.065

M3 - Article

SN - 0026-2714

VL - 45

SP - 1633

EP - 1638

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 9-11

ER -