Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

C Liu; GQ Zhang; WD van Driel; RBR van Silfhout; MAJ van Gils; LJ Ernst

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

C Liu, GQ Zhang, WD van Driel, RBR van Silfhout, MAJ van Gils, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Thermal & mechanical simulation and experiments in microelectronics and microsystems
Editors	LJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	337-343
Number of pages	7
ISBN (Print)	0-7803-7054-6
Publication status	Published - 2003
Event	EuroSimE 2003: 4th International Conference - Aix-en-Provence, France Duration: 30 Mar 2003 → 2 Apr 2003 Conference number: 4

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2003
Country/Territory	France
City	Aix-en-Provence
Period	30/03/03 → 2/04/03

Keywords

Conf.proc. > 3 pag

Cite this

Liu, C., Zhang, GQ., van Driel, WD., van Silfhout, RBR., van Gils, MAJ., & Ernst, LJ. (2003). Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. In LJ. Ernst, GQ. Zhang, R. Dudek, & O. de Saint Leger (Eds.), Thermal & mechanical simulation and experiments in microelectronics and microsystems (pp. 337-343). IEEE Society.

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title = "Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods",

keywords = "Conf.proc. > 3 pag",

author = "C Liu and GQ Zhang and {van Driel}, WD and {van Silfhout}, RBR and {van Gils}, MAJ and LJ Ernst",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-7054-6",

publisher = "IEEE Society",

pages = "337--343",

editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",

booktitle = "Thermal & mechanical simulation and experiments in microelectronics and microsystems",

note = "EuroSimE 2003 ; Conference date: 30-03-2003 Through 02-04-2003",

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Liu, C, Zhang, GQ, van Driel, WD, van Silfhout, RBR, van Gils, MAJ & Ernst, LJ 2003, Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. in LJ Ernst, GQ Zhang, R Dudek & O de Saint Leger (eds), Thermal & mechanical simulation and experiments in microelectronics and microsystems. IEEE Society, Piscataway, pp. 337-343, EuroSimE 2003, Aix-en-Provence, France, 30/03/03.

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. / Liu, C; Zhang, GQ; van Driel, WD et al.
Thermal & mechanical simulation and experiments in microelectronics and microsystems. ed. / LJ Ernst; GQ Zhang; R Dudek; O de Saint Leger. Piscataway: IEEE Society, 2003. p. 337-343.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

AU - Liu, C

AU - Zhang, GQ

AU - van Driel, WD

AU - van Silfhout, RBR

AU - van Gils, MAJ

AU - Ernst, LJ

N1 - Conference code: 4

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7054-6

SP - 337

EP - 343

BT - Thermal & mechanical simulation and experiments in microelectronics and microsystems

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Dudek, R

A2 - de Saint Leger, O

PB - IEEE Society

CY - Piscataway

T2 - EuroSimE 2003

Y2 - 30 March 2003 through 2 April 2003

ER -

Liu C, Zhang GQ, van Driel WD, van Silfhout RBR, van Gils MAJ, Ernst LJ. Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. In Ernst LJ, Zhang GQ, Dudek R, de Saint Leger O, editors, Thermal & mechanical simulation and experiments in microelectronics and microsystems. Piscataway: IEEE Society. 2003. p. 337-343