• YY Leung
  • M Sadeghinia
  • H Pape
  • LJ Ernst
Delamination between copper and epoxy molding compound (EMC) is one of the common failure modes in packages due to relatively weak adhesion at the interface. Delamination is difficult to predict because a package is often with a complex structure design constructed with different materials and under combined normal and shear loading. Development of cohesive zone elements applied in FEM has emerged into the application of cohesive zones as an effective tool for crack propagation simulation. In this study, a methodology to obtain useful parameters for cohesive zone modeling from experimental measurements is proposed. The approach is demonstrated with the adhesive joint between epoxy molding compound and copper that was under residual stresses and applied mixed-mode loading. The proposed approach to determine the traction-separation function does not rely on the uncertainties of crack tip stresses. The predicted load-displacement result is matched with experimental measurement results at the crack propagation region. Package delamination can be predicted by implementing the proposed testing and modeling scheme within the cohesive zone model.
Original languageEnglish
Title of host publicationProceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria
EditorsLJ Ernst, GQ Zhang, WD van Driel, P Rodgers, C Bailey, O de Saint Leger
Place of PublicationLinz, Austria
PublisherIEEE Society
Pages1-7
Number of pages7
ISBN (Print)978-1-4577-0105-4
Publication statusPublished - 2011
EventEuroSimE 2011: 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Linz, Austria
Duration: 18 Apr 201120 Apr 2011
Conference number: 12

Publication series

Name
PublisherIEEE

Conference

ConferenceEuroSimE 2011
CountryAustria
CityLinz
Period18/04/1120/04/11

    Research areas

  • conference contrib. refereed, Conf.proc. > 3 pag

ID: 1602292