@inproceedings{68171dfa3a734b2c80854b3436a79a06,
title = "Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers",
keywords = "Conf.proc. > 3 pag",
author = "D Yang and KMB Jansen and LJ Ernst and GQ Zhang and {van Driel}, WD and HJL Bressers and XJ Fan",
note = "IEEE Catalog No. 04CH37546; 54th electronic components and technology conference ; Conference date: 01-06-2004 Through 04-06-2004",
year = "2004",
language = "Undefined/Unknown",
isbn = "0-7803-8365-6",
publisher = "IEEE ",
pages = "98--105",
editor = "S.n.",
booktitle = "54th electronic components and technology conference. Vol. 2",
address = "United States",
}