Preparation and characterization of fibrous copper powder used for conductive filler.

Y Fan; Y Yang; Y Xiao; Z Zhao

Preparation and characterization of fibrous copper powder used for conductive filler.

Y Fan, Y Yang, Y Xiao, Z Zhao

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of REWAS 2013: Enabling Materials Resource Sustainability.
Editors	A Kvithyld, C Meskers, R Kirchain, G Krumdick
Place of Publication	Hoboken, NJ, USA
Publisher	John Wiley & Sons
Pages	122-132
Number of pages	11
ISBN (Print)	978-1-11860-587-5
Publication status	Published - 2013
Event	TMS 2013 Annual Meeting & Exhibition, San Antonio, Texas, USA - Hoboken, NJ, USA Duration: 3 Mar 2013 → 7 Mar 2013

Publication series

Name
Publisher	John Wiley & Sons

Conference

Conference	TMS 2013 Annual Meeting & Exhibition, San Antonio, Texas, USA
Period	3/03/13 → 7/03/13

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{83c6158509ce4590bf52d761a87ede71,

title = "Preparation and characterization of fibrous copper powder used for conductive filler.",

keywords = "Conf.proc. > 3 pag",

author = "Y Fan and Y Yang and Y Xiao and Z Zhao",

year = "2013",

language = "English",

isbn = "978-1-11860-587-5",

publisher = "John Wiley & Sons",

pages = "122--132",

editor = "A Kvithyld and C Meskers and R Kirchain and G Krumdick",

booktitle = "Proceedings of REWAS 2013: Enabling Materials Resource Sustainability.",

note = "TMS 2013 Annual Meeting & Exhibition, San Antonio, Texas, USA ; Conference date: 03-03-2013 Through 07-03-2013",

}

Fan, Y, Yang, Y, Xiao, Y & Zhao, Z 2013, Preparation and characterization of fibrous copper powder used for conductive filler. in A Kvithyld, C Meskers, R Kirchain & G Krumdick (eds), Proceedings of REWAS 2013: Enabling Materials Resource Sustainability.. John Wiley & Sons, Hoboken, NJ, USA, pp. 122-132, TMS 2013 Annual Meeting & Exhibition, San Antonio, Texas, USA, 3/03/13.

Preparation and characterization of fibrous copper powder used for conductive filler. / Fan, Y; Yang, Y; Xiao, Y et al.
Proceedings of REWAS 2013: Enabling Materials Resource Sustainability.. ed. / A Kvithyld; C Meskers; R Kirchain; G Krumdick. Hoboken, NJ, USA: John Wiley & Sons, 2013. p. 122-132.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Preparation and characterization of fibrous copper powder used for conductive filler.

AU - Fan, Y

AU - Yang, Y

AU - Xiao, Y

AU - Zhao, Z

PY - 2013

Y1 - 2013

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-11860-587-5

SP - 122

EP - 132

BT - Proceedings of REWAS 2013: Enabling Materials Resource Sustainability.

A2 - Kvithyld, A

A2 - Meskers, C

A2 - Kirchain, R

A2 - Krumdick, G

PB - John Wiley & Sons

CY - Hoboken, NJ, USA

T2 - TMS 2013 Annual Meeting & Exhibition, San Antonio, Texas, USA

Y2 - 3 March 2013 through 7 March 2013

ER -