TY - JOUR
T1 - Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method
AU - Chen, Wei
AU - Fan, Jiajie
AU - Qian, Cheng
AU - Pu, Bin
AU - Fan, Xuejun
AU - Zhang, Guo Qi
PY - 2019
Y1 - 2019
N2 - The inherent luminous characteristics and stability of LED packages during the operation period are highly dependent on their junction temperatures and driving currents. In this paper, the luminous flux of LED packages operated under a wide range of driving currents and junction temperatures are investigated to develop a luminous flux response surface model. The coefficients of the proposed model are further extracted to compare the luminous efficacy decay mechanisms of LED packages with different packaging structures. Furthermore, a spectral power distribution (SPD) method modeled by the Gaussian function is proposed to analyze the long-term degradation mechanisms of all selected LED packages. The results of this study show that: (1) The luminous flux of phosphor converted white LED decreases to accompany with the increase of junction temperature, while that of bare blue LED die keeps relatively stable; (2) The proposed general luminous flux response surface model can be used to predict the luminous flux of LEDs with different packaging technologies accurately, and it can be known from the proposed model that the influences of driving current and temperature on LED chip and phosphor vary with different packaging structures; and (3) The driving current and temperature dependent sensitivities and degradation mechanisms of LED packages can be investigated by using both the luminous flux response surface model and the spectral power distribution method.
AB - The inherent luminous characteristics and stability of LED packages during the operation period are highly dependent on their junction temperatures and driving currents. In this paper, the luminous flux of LED packages operated under a wide range of driving currents and junction temperatures are investigated to develop a luminous flux response surface model. The coefficients of the proposed model are further extracted to compare the luminous efficacy decay mechanisms of LED packages with different packaging structures. Furthermore, a spectral power distribution (SPD) method modeled by the Gaussian function is proposed to analyze the long-term degradation mechanisms of all selected LED packages. The results of this study show that: (1) The luminous flux of phosphor converted white LED decreases to accompany with the increase of junction temperature, while that of bare blue LED die keeps relatively stable; (2) The proposed general luminous flux response surface model can be used to predict the luminous flux of LEDs with different packaging technologies accurately, and it can be known from the proposed model that the influences of driving current and temperature on LED chip and phosphor vary with different packaging structures; and (3) The driving current and temperature dependent sensitivities and degradation mechanisms of LED packages can be investigated by using both the luminous flux response surface model and the spectral power distribution method.
KW - degradation mechanism
KW - Light-emitting diode
KW - luminous efficacy decay
KW - luminous flux response surface model
KW - spectral power distribution
UR - http://www.scopus.com/inward/record.url?scp=85067230498&partnerID=8YFLogxK
U2 - 10.1109/ACCESS.2019.2916878
DO - 10.1109/ACCESS.2019.2916878
M3 - Article
AN - SCOPUS:85067230498
SN - 2169-3536
VL - 7
SP - 68495
EP - 68502
JO - IEEE Access
JF - IEEE Access
M1 - 8715353
ER -