Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding

JJM Zaal; WD van Driel; GJAM Verheijden; GQ Zhang

Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding

JJM Zaal, WD van Driel, GJAM Verheijden, GQ Zhang

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

1 Citation (Scopus)

Abstract

With the ever-growing number of MEMS resonator applications, a research effort is required. One important step to consider in the design and evaluation phase is the packaging of such a resonator.

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13, 2009, Beijing, China
Editors	s.n.
Place of Publication	Beijing, China
Publisher	IEEE Society
Pages	679-683
Number of pages	5
ISBN (Print)	978-1-4244-4659-9
Publication status	Published - 2009
Event	2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China - Beijing, China Duration: 10 Aug 2009 → 13 Aug 2009

Publication series

Name
Publisher	IEEE

Conference

Conference	2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China
Period	10/08/09 → 13/08/09

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{6778ce31cddf49f5987d089fdc369d8c,

title = "Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding",

abstract = "With the ever-growing number of MEMS resonator applications, a research effort is required. One important step to consider in the design and evaluation phase is the packaging of such a resonator.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "JJM Zaal and {van Driel}, WD and GJAM Verheijden and GQ Zhang",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4659-9",

publisher = "IEEE Society",

pages = "679--683",

editor = "s.n.",

booktitle = "Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13, 2009, Beijing, China",

note = "2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China ; Conference date: 10-08-2009 Through 13-08-2009",

}

Zaal, JJM, van Driel, WD, Verheijden, GJAM & Zhang, GQ 2009, Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding. in s.n. (ed.), Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13, 2009, Beijing, China. IEEE Society, Beijing, China, pp. 679-683, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China, 10/08/09.

Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding. / Zaal, JJM; van Driel, WD; Verheijden, GJAM et al.
Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13, 2009, Beijing, China. ed. / s.n. Beijing, China: IEEE Society, 2009. p. 679-683.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding

AU - Zaal, JJM

AU - van Driel, WD

AU - Verheijden, GJAM

AU - Zhang, GQ

PY - 2009

Y1 - 2009

N2 - With the ever-growing number of MEMS resonator applications, a research effort is required. One important step to consider in the design and evaluation phase is the packaging of such a resonator.

AB - With the ever-growing number of MEMS resonator applications, a research effort is required. One important step to consider in the design and evaluation phase is the packaging of such a resonator.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4659-9

SP - 679

EP - 683

BT - Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13, 2009, Beijing, China

A2 - s.n., null

PB - IEEE Society

CY - Beijing, China

T2 - 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China

Y2 - 10 August 2009 through 13 August 2009

ER -