TY - JOUR
T1 - Review of Packaging Schemes for Power Module
AU - Hou, Fengze
AU - Wang, Wenbo
AU - Cao, Liqiang
AU - Li, Jun
AU - Su, Meiying
AU - Lin, Tingyu
AU - Zhang, Guoqi
AU - Ferreira, Braham
PY - 2020/3/1
Y1 - 2020/3/1
N2 - SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance and heat dissipation issues that are inherent with aluminum wires. In this article, low parasitic inductance and high-efficient cooling interconnection techniques for Si power modules, which are the foundation of packaging methods of SiC ones, are reviewed first. Then, attempts on developing packaging techniques for SiC power modules are thoroughly overviewed. Finally, scientific challenges in the packaging of SiC power module are summarized.
AB - SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance and heat dissipation issues that are inherent with aluminum wires. In this article, low parasitic inductance and high-efficient cooling interconnection techniques for Si power modules, which are the foundation of packaging methods of SiC ones, are reviewed first. Then, attempts on developing packaging techniques for SiC power modules are thoroughly overviewed. Finally, scientific challenges in the packaging of SiC power module are summarized.
KW - High-efficient cooling
KW - low parasitic inductance
KW - packaging schemes
KW - scientific challenges
KW - SiC power module
UR - http://www.scopus.com/inward/record.url?scp=85079436549&partnerID=8YFLogxK
U2 - 10.1109/JESTPE.2019.2947645
DO - 10.1109/JESTPE.2019.2947645
M3 - Review article
AN - SCOPUS:85079436549
SN - 2168-6777
VL - 8
SP - 223
EP - 238
JO - IEEE Journal of Emerging and Selected Topics in Power Electronics
JF - IEEE Journal of Emerging and Selected Topics in Power Electronics
IS - 1
M1 - 8869891
ER -