Smart textiles: How electronics merge into our clothing

K. M.B. Jansen*

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

9 Citations (Scopus)
452 Downloads (Pure)

Abstract

Smart textiles are textiles with integrated sensors, data processing, communication and power units and can be regarded as a new application field for microelectronic devices. It largely benefits from a series of recent developments: sensors become smaller, more reliable and require less power and, on the other hand, energy harvesting techniques are continuously improving as well as energy storage devices as flexible batteries and super capacitors. Based on these rapid developments it is not unlikely to expect that in the near future we indeed will have textiles with an integrated battery less sensor network which will continuously monitor the health of patients, soldiers or you yourself.In this paper we show that before these e-textiles are as widely spread and accepted as our cell phones, a number of hurdles must be taken first.

Original languageEnglish
Title of host publication2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Place of PublicationPiscataway, NJ, USA
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages4
ISBN (Electronic)978-1-5386-8040-7
ISBN (Print)978-1-5386-8041-4
DOIs
Publication statusPublished - 2019
Event20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Hannover, Germany
Duration: 24 Mar 201927 Mar 2019
Conference number: 20th

Publication series

Name2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019

Conference

Conference20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Country/TerritoryGermany
CityHannover
Period24/03/1927/03/19

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