Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

JJM Zaal; HP Hochstenbach; WD van Driel; GQ Zhang

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

JJM Zaal, HP Hochstenbach, WD van Driel, GQ Zhang

Computational Design and Mechanics

Research output: Contribution to journal › Article › Scientific › peer-review

11 Citations (Scopus)

Abstract

The use of microelectronic components in mobile appliances is constantly increasing. Appliances like mobile phones, PDA's and navigation systems contain more and more functionality and smaller microelectronic components.

Original language	Undefined/Unknown
Pages (from-to)	846-852
Number of pages	7
Journal	Microelectronics Reliability
Volume	49
Issue number	2009
Publication status	Published - 2009

Keywords

academic journal papers
CWTS JFIS < 0.75

Cite this

@article{3e28aeb2779c4a559272c0b887983157,

title = "Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull",

abstract = "The use of microelectronic components in mobile appliances is constantly increasing. Appliances like mobile phones, PDA's and navigation systems contain more and more functionality and smaller microelectronic components.",

keywords = "academic journal papers, CWTS JFIS < 0.75",

author = "JJM Zaal and HP Hochstenbach and {van Driel}, WD and GQ Zhang",

year = "2009",

language = "Undefined/Unknown",

volume = "49",

pages = "846--852",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

number = "2009",

}

TY - JOUR

T1 - Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

AU - Zaal, JJM

AU - Hochstenbach, HP

AU - van Driel, WD

AU - Zhang, GQ

PY - 2009

Y1 - 2009

N2 - The use of microelectronic components in mobile appliances is constantly increasing. Appliances like mobile phones, PDA's and navigation systems contain more and more functionality and smaller microelectronic components.

AB - The use of microelectronic components in mobile appliances is constantly increasing. Appliances like mobile phones, PDA's and navigation systems contain more and more functionality and smaller microelectronic components.

KW - academic journal papers

KW - CWTS JFIS < 0.75

M3 - Article

SN - 0026-2714

VL - 49

SP - 846

EP - 852

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 2009

ER -