@inproceedings{5f016a0409ad4ed79877b9ae29abcc39,
title = "Stacking Order Impact on Overall 3D Die-to-Wafer Stacked-IC Cost",
keywords = "Conf.proc. > 3 pag",
author = "M Taouil and S Hamdioui",
year = "2011",
doi = "10.1109/DDECS.2011.5783107",
language = "English",
isbn = "978-1-4244-9756-0",
publisher = "IEEE Society",
pages = "335--340",
editor = "R Kraemer and A Steininger and A Pawlak and {et al.}",
booktitle = "IEEE Symposium on Design and Diagnostics of Electronic Circuits and Systems",
note = "DDECS 2011 ; Conference date: 13-04-2011 Through 14-04-2011",
}