@inproceedings{39182e4a217e454f9277dc6756932fca,
title = "Testing solder interconnect reliabilty under drop impact loading conditions",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "JJM Zaal and {van Driel}, WD and HP Hochstenbach and GQ Zhang",
year = "2007",
language = "Undefined/Unknown",
publisher = "s.n.",
pages = "1--6",
editor = "s.n.",
booktitle = "8th ICEPT (International Conference on Electronics Packaging Technology)",
note = "8th ICEPT (International Conference on Electronics Packaging Technology) ; Conference date: 14-08-2007 Through 18-08-2007",
}