Testing solder interconnect reliabilty under drop impact loading conditions

JJM Zaal, WD van Driel, HP Hochstenbach, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publication8th ICEPT (International Conference on Electronics Packaging Technology)
Editors s.n.
Place of Publications.l.
Publishers.n.
Pages1-6
Number of pages6
Publication statusPublished - 2007
Event8th ICEPT (International Conference on Electronics Packaging Technology) - s.l.
Duration: 14 Aug 200718 Aug 2007

Publication series

Name
Publishers.n.

Conference

Conference8th ICEPT (International Conference on Electronics Packaging Technology)
Period14/08/0718/08/07

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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