@inproceedings{7201a092c91d424193358e3de6c28b77,
title = "The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film",
abstract = "We propose a molecular modeling method which is capable of modeling the mechanical impact of the porosity and pore size to the amorphous silicon-based low-dielectric (low-k) material. Due to the electronic requirement of advanced electronic devices, low-k materials are in demand for the IC backend structure. However, due to the amorphous nature and porosity of this material, it exhibits low mechanical stiffness and low interfacial strength, as well as inducing numerous reliability issues. The mechanical impact of the nano-scaled pore, including the porosity ratio and pore size, is simulated using molecular dynamics on the mechanical stiffness and interfacial strength. A fitting function is formulated based on the continuum homogenous theory and atomic interaction in nano-scale. The simulation results are fitted into analytical equations based on the homogenous theory.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "CA Yuan and AE Flower and {van der Sluis}, O and GQ Zhang and LJ Ernst and M Cherkaoui and {van Driel}, WD",
year = "2008",
language = "Undefined/Unknown",
isbn = "978-1-4244-2127-5",
publisher = "EuroSimE",
pages = "199--203",
editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Driel, W.D. van} and {Rodgers, P.} and {Saint Leger, O. de}",
booktitle = "Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems",
note = "9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems ; Conference date: 21-04-2008 Through 23-04-2008",
}