The Rationale and Paradigm of "More than Moore"

GQ Zhang, M Graef, F van Roosmalen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

36 Citations (Scopus)

Abstract

For several decades, microelectronic industries and relevant academic communities have been spending tremendous effort in developing and commercializing the Moore's law, leading to not only many breakthroughs and revolution in ICT, but also noticeable changes in the way of living of human beings. While this trend will still be valid, pushing microelectronics to the nanoelectronic era, in recent years, there are ever-increasing awareness, R&D effort and business drivers to speed up the development and application of "More than Moore" that are based upon or derived from silicon technologies but do not scale with Moore's law (with typical examples as RF, Power/HV, Sensor/Actuator/MEMS, SiP, SSL, ets.). The future business opportunities and technology challenges will be the innovations and effective integration of Moore's law focusing mainly on digital function with MtM focusing mainly on non-digital function and heterogeneous integration. Starting from the rational of MtM, this paper will highlight some strategic research issues of sensors and actuators within the technology domain MtM. Some issues related to the paradigm of MtM, covering industrial vision, strategy and business models, will also be discussed.
Original languageUndefined/Unknown
Title of host publicationProceedings 56th Electronic Components & Technology Conference 2006
Editors sn
Place of PublicationSan Diego, CA, USA
PublisherIEEE Society
Pages151-157
Number of pages7
ISBN (Print)1-4244-0152-6
Publication statusPublished - 2006
Event56th Electronic Components & Technology Conference 2006 - San Diego, CA, USA
Duration: 30 May 20062 Jun 2006

Publication series

Name
PublisherIEEE

Conference

Conference56th Electronic Components & Technology Conference 2006
Period30/05/062/06/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

Cite this