• Bingbing Zhang
  • Micheal Johlitz
  • Alexander Lion
  • L.J. Ernst
  • Kaspar Jansen
  • Duc-Khoi Vu
  • Laurens Weiss

In microelectronic packages, generally the chip is encapsulated by a molding compound (MC). The MC provides a mechanical support for the chip and isolates it from the environment and as a result protects the encapsulated chip. It is well known that MC's are polymer-based materials. When packages are exposed to a harsh environment such as to high-temperature storage or to thermal cycling, the mechanical properties of the MC's can change significantly. Consequently this could result into reliability issues of these packages. For a long time, there was no simple and efficient model method available to simulate the mechanical behavior of these packages under thermal aging conditions. As a result, it was hard to forecast the package reliability after a period of thermal aging. Since in our previous work [1,2] the thermomechanical properties of MC's before and after thermal aging were systematically characterized, the above problem was merely solved. A simple and efficient modeling method was proposed to simulate the thermal aging effects on MC's [2]. In this paper, a bi-material sample consisting of a MC layer on a Copper substrate is prepared and used to verify the proposed modeling method at two different thermal conditions: High-temperature storage (HTS) and Temperature cycling (TC). Based on the proposed modeling method the mechanical behavior of the bi-material sample after aging under these (different) thermal conditions are established throug FEM simulation. The simulation results match the experiment results quite well.

Original languageEnglish
Title of host publication2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages1-5
Number of pages5
ISBN (Electronic)978-1-5386-2359-6
ISBN (Print)978-1-5386-2360-2
DOIs
Publication statusPublished - 2018
EventEuroSimE 2018: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Toulouse, France
Duration: 15 Apr 201818 Apr 2018

Conference

ConferenceEuroSimE 2018
Abbreviated titleEuroSimE 2018
CountryFrance
CityToulouse
Period15/04/1818/04/18

    Research areas

  • Aging, High-temperature superconductors, Temperature measurement, Microelectronics, Ovens, Electronic packaging thermal management, Compounds

ID: 45584353