Abstract
In microelectronic packages, generally the chip is encapsulated by a molding compound (MC). The MC provides a mechanical support for the chip and isolates it from the environment and as a result protects the encapsulated chip. It is well known that MC's are polymer-based materials. When packages are exposed to a harsh environment such as to high-temperature storage or to thermal cycling, the mechanical properties of the MC's can change significantly. Consequently this could result into reliability issues of these packages. For a long time, there was no simple and efficient model method available to simulate the mechanical behavior of these packages under thermal aging conditions. As a result, it was hard to forecast the package reliability after a period of thermal aging. Since in our previous work [1,2] the thermomechanical properties of MC's before and after thermal aging were systematically characterized, the above problem was merely solved. A simple and efficient modeling method was proposed to simulate the thermal aging effects on MC's [2]. In this paper, a bi-material sample consisting of a MC layer on a Copper substrate is prepared and used to verify the proposed modeling method at two different thermal conditions: High-temperature storage (HTS) and Temperature cycling (TC). Based on the proposed modeling method the mechanical behavior of the bi-material sample after aging under these (different) thermal conditions are established throug FEM simulation. The simulation results match the experiment results quite well.
Original language | English |
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Title of host publication | 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018 |
Place of Publication | Piscataway, NJ |
Publisher | IEEE |
Pages | 1-5 |
Number of pages | 5 |
ISBN (Electronic) | 978-1-5386-2359-6 |
ISBN (Print) | 978-1-5386-2360-2 |
DOIs | |
Publication status | Published - 2018 |
Event | EuroSimE 2018: 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Toulouse, France Duration: 15 Apr 2018 → 18 Apr 2018 |
Conference
Conference | EuroSimE 2018 |
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Abbreviated title | EuroSimE 2018 |
Country/Territory | France |
City | Toulouse |
Period | 15/04/18 → 18/04/18 |
Keywords
- Aging
- High-temperature superconductors
- Temperature measurement
- Microelectronics
- Ovens
- Electronic packaging thermal management
- Compounds