Standard

Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions. / Zhang, Bingbing; Johlitz, Micheal; Lion, Alexander; Ernst, L.J.; Jansen, Kaspar; Vu, Duc-Khoi; Weiss, Laurens.

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ : IEEE, 2018. p. 1-5.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Zhang, B, Johlitz, M, Lion, A, Ernst, LJ, Jansen, K, Vu, D-K & Weiss, L 2018, Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions. in 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. IEEE, Piscataway, NJ, pp. 1-5, EuroSimE 2018, Toulouse, France, 15/04/18. https://doi.org/10.1109/EuroSimE.2018.8369890

APA

Zhang, B., Johlitz, M., Lion, A., Ernst, L. J., Jansen, K., Vu, D-K., & Weiss, L. (2018). Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions. In 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018 (pp. 1-5). Piscataway, NJ: IEEE. https://doi.org/10.1109/EuroSimE.2018.8369890

Vancouver

Zhang B, Johlitz M, Lion A, Ernst LJ, Jansen K, Vu D-K et al. Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions. In 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE. 2018. p. 1-5 https://doi.org/10.1109/EuroSimE.2018.8369890

Author

Zhang, Bingbing ; Johlitz, Micheal ; Lion, Alexander ; Ernst, L.J. ; Jansen, Kaspar ; Vu, Duc-Khoi ; Weiss, Laurens. / Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions. 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ : IEEE, 2018. pp. 1-5

BibTeX

@inproceedings{440500a20ae14f3b9335ff9e565c4480,
title = "Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions",
abstract = "In microelectronic packages, generally the chip is encapsulated by a molding compound (MC). The MC provides a mechanical support for the chip and isolates it from the environment and as a result protects the encapsulated chip. It is well known that MC's are polymer-based materials. When packages are exposed to a harsh environment such as to high-temperature storage or to thermal cycling, the mechanical properties of the MC's can change significantly. Consequently this could result into reliability issues of these packages. For a long time, there was no simple and efficient model method available to simulate the mechanical behavior of these packages under thermal aging conditions. As a result, it was hard to forecast the package reliability after a period of thermal aging. Since in our previous work [1,2] the thermomechanical properties of MC's before and after thermal aging were systematically characterized, the above problem was merely solved. A simple and efficient modeling method was proposed to simulate the thermal aging effects on MC's [2]. In this paper, a bi-material sample consisting of a MC layer on a Copper substrate is prepared and used to verify the proposed modeling method at two different thermal conditions: High-temperature storage (HTS) and Temperature cycling (TC). Based on the proposed modeling method the mechanical behavior of the bi-material sample after aging under these (different) thermal conditions are established throug FEM simulation. The simulation results match the experiment results quite well.",
keywords = "Aging, High-temperature superconductors, Temperature measurement, Microelectronics, Ovens, Electronic packaging thermal management, Compounds",
author = "Bingbing Zhang and Micheal Johlitz and Alexander Lion and L.J. Ernst and Kaspar Jansen and Duc-Khoi Vu and Laurens Weiss",
year = "2018",
doi = "10.1109/EuroSimE.2018.8369890",
language = "English",
isbn = "978-1-5386-2360-2",
pages = "1--5",
booktitle = "2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018",
publisher = "IEEE",
address = "United States",

}

RIS

TY - GEN

T1 - Thermal aging modeling of molding compound under high-temperature storage and temperature cycling conditions

AU - Zhang, Bingbing

AU - Johlitz, Micheal

AU - Lion, Alexander

AU - Ernst, L.J.

AU - Jansen, Kaspar

AU - Vu, Duc-Khoi

AU - Weiss, Laurens

PY - 2018

Y1 - 2018

N2 - In microelectronic packages, generally the chip is encapsulated by a molding compound (MC). The MC provides a mechanical support for the chip and isolates it from the environment and as a result protects the encapsulated chip. It is well known that MC's are polymer-based materials. When packages are exposed to a harsh environment such as to high-temperature storage or to thermal cycling, the mechanical properties of the MC's can change significantly. Consequently this could result into reliability issues of these packages. For a long time, there was no simple and efficient model method available to simulate the mechanical behavior of these packages under thermal aging conditions. As a result, it was hard to forecast the package reliability after a period of thermal aging. Since in our previous work [1,2] the thermomechanical properties of MC's before and after thermal aging were systematically characterized, the above problem was merely solved. A simple and efficient modeling method was proposed to simulate the thermal aging effects on MC's [2]. In this paper, a bi-material sample consisting of a MC layer on a Copper substrate is prepared and used to verify the proposed modeling method at two different thermal conditions: High-temperature storage (HTS) and Temperature cycling (TC). Based on the proposed modeling method the mechanical behavior of the bi-material sample after aging under these (different) thermal conditions are established throug FEM simulation. The simulation results match the experiment results quite well.

AB - In microelectronic packages, generally the chip is encapsulated by a molding compound (MC). The MC provides a mechanical support for the chip and isolates it from the environment and as a result protects the encapsulated chip. It is well known that MC's are polymer-based materials. When packages are exposed to a harsh environment such as to high-temperature storage or to thermal cycling, the mechanical properties of the MC's can change significantly. Consequently this could result into reliability issues of these packages. For a long time, there was no simple and efficient model method available to simulate the mechanical behavior of these packages under thermal aging conditions. As a result, it was hard to forecast the package reliability after a period of thermal aging. Since in our previous work [1,2] the thermomechanical properties of MC's before and after thermal aging were systematically characterized, the above problem was merely solved. A simple and efficient modeling method was proposed to simulate the thermal aging effects on MC's [2]. In this paper, a bi-material sample consisting of a MC layer on a Copper substrate is prepared and used to verify the proposed modeling method at two different thermal conditions: High-temperature storage (HTS) and Temperature cycling (TC). Based on the proposed modeling method the mechanical behavior of the bi-material sample after aging under these (different) thermal conditions are established throug FEM simulation. The simulation results match the experiment results quite well.

KW - Aging

KW - High-temperature superconductors

KW - Temperature measurement

KW - Microelectronics

KW - Ovens

KW - Electronic packaging thermal management

KW - Compounds

UR - http://www.scopus.com/inward/record.url?scp=85048896111&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE.2018.8369890

DO - 10.1109/EuroSimE.2018.8369890

M3 - Conference contribution

SN - 978-1-5386-2360-2

SP - 1

EP - 5

BT - 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018

PB - IEEE

CY - Piscataway, NJ

ER -

ID: 45584353