The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the glass transition temperature increased and that these effects are accompanied with a relatively large amount of shrinkage. All effects can be interpreted in terms of the formation of an oxidized layer where extra crosslinking occurred.
Original languageEnglish
Title of host publicationProceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 16-19 August 2010, Xi'an, China
Editors n.a.
Place of PublicationXi'an, China
PublisherIEEE Society
Pages778-780
Number of pages3
ISBN (Print)978-1-4244-8140-8
Publication statusPublished - 2010
Event11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Xi'an, China - Xi'an, China
Duration: 16 Aug 201019 Aug 2010

Publication series

Name
PublisherIEEE

Conference

Conference11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Xi'an, China
Period16/08/1019/08/10

    Research areas

  • conference contrib. refereed, Geen BTA classificatie

ID: 3727113