Thermal Modelling and Experimental Validation for Research on Medium Voltage DC Cables

A. Shekhar, X. Feng, R. Hebner, A. Gattozzi, S. Strank, A. Mor, L. Ramirez-Elizondo, P. Bauer

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
633 Downloads (Pure)

Abstract

The thermal behavior of medium voltage dc cables can find useful applications for efficient and capacity enhanced operation in cities as well as compact power transmission on all electric ships. Concepts such as dynamic current and voltage rating, difference in thermal proximity in ac and dc operation, pulsed load application and thermal degradation with enhanced dc voltage; all are interlaced with the crucial temperature profile of insulated conductors. This paper develops a theoretical thermal model to highlight the possibility of dynamic current rating with pulsed loads. Further, a novel idea of imposing a thermal profile on cables for dc partial discharge testing is discussed. For this purpose a heat transfer model for a segmented cable is developed and experimentally validated.

Original languageEnglish
Title of host publication2017 IEEE Power and Energy Society General Meeting, PESGM 2017
Place of PublicationPiscataway, NJ
PublisherIEEE
Pages1-5
Number of pages5
Volume2018-January
ISBN (Electronic)978-1-5386-2212-4
DOIs
Publication statusPublished - 2018
EventIEEE Power and Energy Society General Meeting, PESGM 2016: Paving the Way for Grid Modernization - Boston, United States
Duration: 17 Jul 201621 Jul 2016

Conference

ConferenceIEEE Power and Energy Society General Meeting, PESGM 2016
Abbreviated titleIEEE PESGM P
Country/TerritoryUnited States
CityBoston
Period17/07/1621/07/16

Keywords

  • Power cables
  • Conductors
  • Cable shielding
  • Thermal conductivity
  • Power cable insulation

Fingerprint

Dive into the research topics of 'Thermal Modelling and Experimental Validation for Research on Medium Voltage DC Cables'. Together they form a unique fingerprint.

Cite this