Thermo-mechanical characterization of packaging polymers during the curing process

C van t Hof; DG Yang; MS Kiasat; LJ Ernst; ? et al

Thermo-mechanical characterization of packaging polymers during the curing process

C van t Hof, DG Yang, MS Kiasat, LJ Ernst, ? et al

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15
Editors	E Suhir, Y Koike, B Michel, J Lu
Place of Publication	New York
Publisher	ASME
Pages	153-158
Number of pages	6
Publication status	Published - 1999

Publication series

Name
Publisher	ASME

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

van t Hof, C., Yang, DG., Kiasat, MS., Ernst, LJ., & et al, . (1999). Thermo-mechanical characterization of packaging polymers during the curing process. In E Suhir, Y Koike, B Michel, & J Lu (Eds.), Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15 (pp. 153-158). ASME.

van t Hof, C ; Yang, DG ; Kiasat, MS et al. / Thermo-mechanical characterization of packaging polymers during the curing process. Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15. editor / E Suhir ; Y Koike ; B Michel ; J Lu. New York : ASME, 1999. pp. 153-158

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title = "Thermo-mechanical characterization of packaging polymers during the curing process",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "{van t Hof}, C and DG Yang and MS Kiasat and LJ Ernst and {et al}, ?",

year = "1999",

language = "Undefined/Unknown",

publisher = "ASME",

pages = "153--158",

editor = "{E Suhir} and {Y Koike} and {B Michel} and {J Lu}",

booktitle = "Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15",

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van t Hof, C, Yang, DG, Kiasat, MS, Ernst, LJ & et al 1999, Thermo-mechanical characterization of packaging polymers during the curing process. in E Suhir, Y Koike, B Michel & J Lu (eds), Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15. ASME, New York, pp. 153-158.

Thermo-mechanical characterization of packaging polymers during the curing process. / van t Hof, C; Yang, DG; Kiasat, MS et al.
Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15. ed. / E Suhir; Y Koike; B Michel; J Lu. New York: ASME, 1999. p. 153-158.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Thermo-mechanical characterization of packaging polymers during the curing process

AU - van t Hof, C

AU - Yang, DG

AU - Kiasat, MS

AU - Ernst, LJ

AU - et al, ?

PY - 1999

Y1 - 1999

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SP - 153

EP - 158

BT - Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15

A2 - E Suhir, null

A2 - Y Koike, null

A2 - B Michel, null

A2 - J Lu, null

PB - ASME

CY - New York

ER -

van t Hof C, Yang DG, Kiasat MS, Ernst LJ, et al. Thermo-mechanical characterization of packaging polymers during the curing process. In E Suhir, Y Koike, B Michel, J Lu, editors, Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanisms, physics, reliability, processing, December 12-15. New York: ASME. 1999. p. 153-158