@inproceedings{a9fb98120aa142208c676a6d613b9c4e,
title = "Thermo-mechanical characterization of packaging polymers during the curing process (niet eerder opgenomen)",
keywords = "ZX Int.klas.verslagjaar < 2002",
author = "{van t Hof}, C and DG Yang and MS Kiasat and LJ Ernst and {et al}, ?",
year = "1999",
language = "Undefined/Unknown",
isbn = "0-7918-1663-X",
publisher = "ASME",
pages = "153--158",
editor = "{E Suhir} and {et al}",
booktitle = "Proceedings of the 1999 workshop on polymeric materials for microelectronics and photonics applications: mechanics physics, reliability, processing, December 12-15",
address = "United States",
note = "workshop on polymeric materials for microelectronics and photonics applications: mechanics physics, reliability, processing ; Conference date: 12-12-2000 Through 15-12-2000",
}