Through Silicon Interconnect Using grayscale Lithography for MEMS Applications

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Eurosensors XXIII
Editors	J Brugger, D Briand
Publisher	Elsevier
Pages	1543-1546
Number of pages	4
Publication status	Published - 2009
Event	Eurosensors XXIII - Lausanne, Switzerland Duration: 6 Sept 2009 → 9 Sept 2009

Name
Publisher	Elsevier BV

Keywords

@inproceedings{7436e2a67c4b41d5b1ff6b9a5d938046,

title = "Through Silicon Interconnect Using grayscale Lithography for MEMS Applications",

keywords = "Conf.proc. > 3 pag",

author = "{van Zeijl}, HW and D Liu and PM Sarro",

year = "2009",

language = "Undefined/Unknown",

publisher = "Elsevier",

pages = "1543--1546",

editor = "J Brugger and D Briand",

booktitle = "Eurosensors XXIII",

note = "Eurosensors XXIII ; Conference date: 06-09-2009 Through 09-09-2009",

}

TY - GEN

T1 - Through Silicon Interconnect Using grayscale Lithography for MEMS Applications

AU - van Zeijl, HW

AU - Liu, D

AU - Sarro, PM

PY - 2009

Y1 - 2009

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1543

EP - 1546

BT - Eurosensors XXIII

A2 - Brugger, J

A2 - Briand, D

PB - Elsevier

T2 - Eurosensors XXIII

Y2 - 6 September 2009 through 9 September 2009

ER -