Miniaturization of clustered high power LEDs by direct molded optics is an upcoming development. This paper discusses the transfer molding process of high aspect ratio optical domes for high brightness multi-LED packages. The fabrication process is separated in three subjects; First mold-cavity manufacturing techniques are discussed. Secondly the mechanics of the hyper-elastic release foils are characterized and analyzed using finite element analysis. Thirdly, silicone flow behavior is characterized for the optimization of the silicone injection parameters and package design. Finally the results are combined to produce an operational demonstrator containing 45 domes, with a height of 7 mm, molded directly on a single board containing LEDs.
Original languageEnglish
Title of host publication2013 Eurpoean Microelectronics Packaging Conference (EMPC)
Place of PublicationPiscataway
PublisherIEEE
Pages1-6
Number of pages6
ISBN (Electronic)978-2-9527-4671-7
Publication statusPublished - 2013
EventMicroelectronics Packaging Conference (EMPC), 2013 European -
Duration: 9 Sep 201312 Sep 2013
http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6684410

Conference

ConferenceMicroelectronics Packaging Conference (EMPC), 2013 European
Period9/09/1312/09/13
Internet address

    Research areas

  • LED, Primary optics, Release foil, Silicone, Transfer molding, HAR

ID: 18491316