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DOI

We present a novel, wafer-based fabrication process that enables integration and assembly of electronic components, such as ASICs and decoupling capacitors, with flexible interconnects. The electronic components are fabricated in, or placed on precisely defined and closely-spaced silicon islands that are connected by interconnects embedded in parylene-based flexible thin film. This fully CMOS compatible approach uses optimized DRIE processes and an SiO2 mesh-shaped mask, allowing for the simultaneous definition of micrometer- to millimeter-sized structures without compromising the flexibility of the device. In a single fabrication flow a unique freedom in dimensions of both the flexible film and the silicon islands can be achieved making this new technique ideal for the realization of semi-flexible/foldable implantable devices, where structures of different sizes have to be combined together for the ultimate miniaturization.
Original languageEnglish
Article number941
Number of pages5
JournalProceedings
Volume2
Issue number13
DOIs
Publication statusPublished - 2018

    Research areas

  • electroceuticals, implantables, miniaturization, integration, flexible interconnect, DRIE

ID: 71245214