The era of smart textiles has begun. Sensors become smaller, more reliable and require less power and the market of garments for health monitoring increases exponentially. The challenges still are in the seamless integration, robustness and ease of use. In this paper the developments and trends are discussed.

Original languageEnglish
Title of host publication2019 Pan Pacific Microelectronics Symposium (Pan Pacific)
Place of PublicationPiscataway, NJ, USA
PublisherIEEE
Pages1-4
Number of pages4
ISBN (Electronic)978-1-9445-4309-9
ISBN (Print)978-1-7281-3629-5
DOIs
Publication statusPublished - 2019
Event2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019 - Kauai, United States
Duration: 11 Feb 201914 Feb 2019

Conference

Conference2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019
CountryUnited States
CityKauai
Period11/02/1914/02/19

    Research areas

  • Fabric Circuit Board, integration, modular design, Smart textiles

ID: 54001293