Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality

E Spaan; E Ooms; WD van Driel; CA Yuan; D Yang; GQ Zhang

Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality

E Spaan, E Ooms, WD van Driel, CA Yuan, D Yang, GQ Zhang

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Abstract

In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.

Original language	English
Title of host publication	Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France
Editors	Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, Saint Leger, O de
Place of Publication	Bordeaux, France
Publisher	IEEE Society
Pages	1-4
Number of pages	4
ISBN (Print)	978-1-4244-7025-9
Publication status	Published - 2010
Event	EuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems - Bordeaux, Frankrijk, Bordeaux, France Duration: 25 Apr 2010 → 28 Apr 2010 Conference number: 11

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2010
Country/Territory	France
City	Bordeaux
Period	25/04/10 → 28/04/10

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Spaan, E., Ooms, E., van Driel, WD., Yuan, CA., Yang, D., & Zhang, GQ. (2010). Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality. In Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, & Saint Leger, O de (Eds.), Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France (pp. 1-4). IEEE Society.

Spaan, E ; Ooms, E ; van Driel, WD et al. / Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality. Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. editor / Ernst, LJ ; Zhang, GQ ; Driel, WD van ; Rodgers, P ; Bailey, C ; Saint Leger, O de. Bordeaux, France : IEEE Society, 2010. pp. 1-4

@inproceedings{5492793a927e4c6ca89340a0a9ea6ec2,

title = "Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality",

abstract = "In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "E Spaan and E Ooms and {van Driel}, WD and CA Yuan and D Yang and GQ Zhang",

year = "2010",

language = "English",

isbn = "978-1-4244-7025-9",

publisher = "IEEE Society",

pages = "1--4",

editor = "{Ernst, LJ} and {Zhang, GQ} and {Driel, WD van} and {Rodgers, P} and {Bailey, C} and {Saint Leger, O de}",

booktitle = "Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France",

note = "EuroSimE 2010 : 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems ; Conference date: 25-04-2010 Through 28-04-2010",

}

Spaan, E, Ooms, E, van Driel, WD, Yuan, CA, Yang, D & Zhang, GQ 2010, Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality. in Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C & Saint Leger, O de (eds), Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. IEEE Society, Bordeaux, France, pp. 1-4, EuroSimE 2010 , Bordeaux, France, 25/04/10.

Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality. / Spaan, E; Ooms, E; van Driel, WD et al.
Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. ed. / Ernst, LJ; Zhang, GQ; Driel, WD van; Rodgers, P; Bailey, C; Saint Leger, O de. Bordeaux, France: IEEE Society, 2010. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality

AU - Spaan, E

AU - Ooms, E

AU - van Driel, WD

AU - Yuan, CA

AU - Yang, D

AU - Zhang, GQ

N1 - Conference code: 11

PY - 2010

Y1 - 2010

N2 - In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.

AB - In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wirebonding process, especially the forces that take a role during this process.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-7025-9

SP - 1

EP - 4

BT - Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France

A2 - Ernst, LJ, null

A2 - Zhang, GQ, null

A2 - Driel, WD van, null

A2 - Rodgers, P, null

A2 - Bailey, C, null

A2 - Saint Leger, O de, null

PB - IEEE Society

CY - Bordeaux, France

T2 - EuroSimE 2010

Y2 - 25 April 2010 through 28 April 2010

ER -

Spaan E, Ooms E, van Driel WD, Yuan CA, Yang D, Zhang GQ. Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality. In Ernst, LJ, Zhang, GQ, Driel, WD van, Rodgers, P, Bailey, C, Saint Leger, O de, editors, Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France. Bordeaux, France: IEEE Society. 2010. p. 1-4

Wire bonding the future: a combined experimental and numerical approach to improve the Cu-wire bonding quality

Abstract

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Keywords

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