Yield Improvement for 3D wafer-to-wafer stacked ICs using wafer matching

Research output: Contribution to journal › Article › Scientific › peer-review

6 Citations (Scopus)

Original language	English
Pages (from-to)	1-23
Number of pages	23
Journal	ACM Transactions on Design Automation of Electronic Systems
Volume	20
Issue number	2
DOIs	https://doi.org/10.1145/2699832
Publication status	Published - 2015

Harvest

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title = "Yield Improvement for 3D wafer-to-wafer stacked ICs using wafer matching",

author = "M Taouil and S Hamdioui and EJ Marinissen",

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year = "2015",

doi = "10.1145/2699832",

language = "English",

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pages = "1--23",

journal = "ACM Transactions on Design Automation of Electronic Systems",

issn = "1084-4309",

publisher = "Association for Computing Machinery (ACM)",

number = "2",

}

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T1 - Yield Improvement for 3D wafer-to-wafer stacked ICs using wafer matching

AU - Taouil, M

AU - Hamdioui, S

AU - Marinissen, EJ

N1 - Harvest

PY - 2015

Y1 - 2015

U2 - 10.1145/2699832

DO - 10.1145/2699832

M3 - Article

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VL - 20

SP - 1

EP - 23

JO - ACM Transactions on Design Automation of Electronic Systems

JF - ACM Transactions on Design Automation of Electronic Systems

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ER -