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Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material
K.M.B. Jansen
M.F. Zhang
L.J. Ernst
D.-K. Vu
L. Weiss
Moulding compound
Moisture
Micro-electronic device
Modelling
Diffusion
Elsevier
Microelectronics Reliability, 107 (2020) 113596. doi:10.1016/j.microrel.2020.113596
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